In the harsh thermal environment of space, where vacuum means cooling devices such as fans cannot be used, effective heat flow management can often provide a particular challenge. Heat must be carried away from high dissipation components using other methods.
RAL Space Thermal Engineering Group carry out board level analysis of PCBs and electronic boxes, using thermal models to predict problem areas and hotspots and to develop designs to maximise the thermal margins of any critical components.
Our team had involvement in the design of several space electronics boxes including:
- Cooler drive electronics for the Planck 4K cooler
- Camera Electronics Box for HMI and AIA of NASA Solar Dynamics Observatory
- D-CIXS electronics
For more information please contact: RAL Space Enquiries
